Changes for page Lam Research Corp
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... ... @@ -2,31 +2,116 @@ 2 2 {{toc/}} 3 3 {{/box}} 4 4 5 -= Paragraph1=5 += Summary = 6 6 7 -Lorem ipsum dolor sit amet, consectetur adipiscing elit, sed do eiusmod tempor incididunt ut labore et dolore magna aliqua. Ut enim ad minim veniam, quis nostrud exercitation ullamco laboris nisi ut aliquip ex ea commodo consequat. Duis aute irure dolor in reprehenderit in voluptate velit esse cillum dolore eu fugiat nulla pariatur. Excepteur sint occaecat cupidatat non proident, sunt in culpa qui officia deserunt mollit anim id est laborum. 7 +* Lam Research Corp is a global supplier of wafer fabrication equipment and services to the semiconductor industry. 8 +* Lam Research Corp maintain a network of facilities throughout Asia, Europe, and the United States. 9 +* Recently Lam Research Acquired SEMSYSCO. 8 8 9 -== Sub-paragraph == 10 10 11 - Loremipsumdolor sitamet, consectetur adipiscinglit, sed do eiusmod tempor incididunt ut labore et dolore magna aliqua.Ut enim ad minim veniam, quis nostrud exercitation ullamco laboris nisi ut aliquipex ea commodo consequat. Duis aute irure dolor in reprehenderit in voluptate velit esse cillum dolore eu fugiatnulla pariatur. Excepteur sint occaecat cupidatat non proident, sunt in culpa qui officia deserunt mollit anim id est laborum.12 +[[image:LRCX0.png||height="243" width="719"]] 12 12 13 -== Sub-paragraph == 14 14 15 -L orem ipsum dolor sitamet,consectetur adipiscingelit,seddoeiusmodtemporincididunt utlaboreet doloremagnaaliqua. Utenim ad minimveniam,quisnostrudexercitationullamco laborisnisi utaliquipexea commodoconsequat.Duis aute iruredolor in reprehenderitvoluptatevelitesse cillum doloreeufugiat nulla pariatur. Excepteursintoccaecatcupidatat non proident, sunt in culpaquiofficia deseruntmollitanim idestlaborum.15 +Lam Research Corp (Nasdaq: LRCX, LSE: 0JT5) is a global supplier of wafer fabrication equipment and services to the semiconductor industry. The company maintain a network of facilities throughout Asia, Europe, and the United States. 16 16 17 -=== Sub-sub paragraph === 18 18 19 - Loremipsum dolor sit amet,consectetur adipiscing elit,sed do eiusmod tempor incididunt ut labore et dolore magna aliqua. Ut enim ad minimveniam, quis nostrud exercitation ullamcolaboris nisi ut aliquipex ea commodo consequat. Duis aute irure dolor inreprehenderitin voluptate velit essecillum dolore eu fugiat nulla pariatur. Excepteur sint occaecat cupidatat non proident, sunt in culpa qui officia deserunt mollit anim id est laborum.18 += Recent Developments = 20 20 20 +**Lam Research Acquires SEMSYSCO to Advance Chip Packaging**{{footnote}}https://newsroom.lamresearch.com/2022-11-15-Lam-Research-Acquires-SEMSYSCO-to-Advance-Chip-Packaging{{/footnote}} 21 21 22 - =Paragraph2=22 +Nov. 15, 2022; Lam Research Corp. announced that it has completed the acquisition of SEMSYSCO GmbH, a global provider of wet processing semiconductor equipment from Gruenwald Equity and other investors. With the addition of SEMSYSCO, Lam gains capabilities in advanced packaging, ideal for leading-edge logic chips and chiplet-based solutions for high-performance computing (HPC), artificial intelligence (AI) and other data-intensive applications. Financial terms of the agreement were not disclosed. 23 23 24 -Lorem ipsum dolor sit amet, consectetur adipiscing elit, sed do eiusmod tempor incididunt ut labore et dolore magna aliqua. Ut enim ad minim veniam, quis nostrud exercitation ullamco laboris nisi ut aliquip ex ea commodo consequat. Duis aute irure dolor in reprehenderit in voluptate velit esse cillum dolore eu fugiat nulla pariatur. Excepteur sint occaecat cupidatat non proident, sunt in culpa qui officia deserunt mollit anim id est laborum. 25 25 26 - ==Sub-paragraph==25 +The acquisition of SEMSYSCO broadens Lam's packaging offerings, bringing a portfolio of innovative cleaning and plating capabilities for chiplet-to-chiplet or chiplet-to-substrate heterogeneous integration. This includes support of fan-out panel-level packaging, a game-changing process in which chips or chiplets are cut from a large, rectangular substrate sheet several times the size of a traditional silicon wafer. This approach enables chipmakers to significantly increase yield and reduce waste. 27 27 28 -Lorem ipsum dolor sit amet, consectetur adipiscing elit, sed do eiusmod tempor incididunt ut labore et dolore magna aliqua. Ut enim ad minim veniam, quis nostrud exercitation ullamco laboris nisi ut aliquip ex ea commodo consequat. Duis aute irure dolor in reprehenderit in voluptate velit esse cillum dolore eu fugiat nulla pariatur. Excepteur sint occaecat cupidatat non proident, sunt in culpa qui officia deserunt mollit anim id est laborum. 29 29 30 - ==Sub-paragraph==28 +With the acquisition of SEMSYSCO, Lam also gains a state-of-the-art R&D facility in Austria focused on next-generation substrates and heterogeneous packaging, broadening the company's strong development capabilities in Europe and adding a sixth lab in Lam's global network. In addition, it brings to Lam new and expanded relationships with chipmakers and fabless customers. 31 31 32 -Lorem ipsum dolor sit amet, consectetur adipiscing elit, sed do eiusmod tempor incididunt ut labore et dolore magna aliqua. Ut enim ad minim veniam, quis nostrud exercitation ullamco laboris nisi ut aliquip ex ea commodo consequat. Duis aute irure dolor in reprehenderit in voluptate velit esse cillum dolore eu fugiat nulla pariatur. Excepteur sint occaecat cupidatat non proident, sunt in culpa qui officia deserunt mollit anim id est laborum. 30 + 31 +[[image:LRCX1.jpg]] 32 + 33 + 34 += Financial Highlights = 35 + 36 +**September 2022 Quarter Results** 37 + 38 +Oct. 19, 2022; Lam Research Corporation announced financial results for the quarter ended September 25, 2022{{footnote}}https://newsroom.lamresearch.com/Lam-Research-Corporation-Reports-Financial-Results-for-the-Quarter-Ended-September-25,-2022{{/footnote}} 39 + 40 + 41 +For the September 2022 quarter, revenue was $5,074 million, gross margin was $2,337 million, or 46.1% of revenue, operating expenses were $639 million, operating income was 33.5% of revenue, and net income was $1,426 million, or $10.39 per diluted share on a U.S. GAAP basis. This compares to revenue of $4,636 million, gross margin of $2,101 million, or 45.3% of revenue, operating expenses of $621 million, operating income of 31.9% of revenue, and net income of $1,209 million, or $8.74 per diluted share, for the quarter ended June 26, 2022. 42 + 43 + 44 +Non-GAAP Financial Results 45 + 46 +For the September 2022 quarter, non-GAAP gross margin was $2,335 million, or 46.0% of revenue, non-GAAP operating expenses were $647 million, non-GAAP operating income was 33.3% of revenue, and non-GAAP net income was $1,429 million, or $10.42 per diluted share. This compares to non-GAAP gross margin of $2,094 million, or 45.2% of revenue, non-GAAP operating expenses of $635 million, non-GAAP operating income of 31.5% of revenue, and non-GAAP net income of $1,221 million, or $8.83 per diluted share, for the June 2022 quarter. 47 + 48 + 49 +Balance Sheet and Cash Flow Results 50 + 51 +Cash and cash equivalents, short-term investments, and restricted cash and investments balances increased to $4.6 billion at the end of the September 2022 quarter compared to $3.9 billion at the end of the June 2022 quarter. This increase was primarily the result of $1,190 million of cash generated from operating activities, partially offset by $206 million of dividends paid to stockholders; $140 million of capital expenditures; and $110 million of share repurchases, including net share settlement of employee stock-based compensation. 52 + 53 + 54 +Deferred revenue at the end of the September 2022 quarter increased to $2,755 million compared to $2,198 million as of the end of the June 2022 quarter. Lam's deferred revenue balance does not include shipments to customers in Japan, to whom title does not transfer until customer acceptances. Shipments to customers in Japan are classified as inventory at cost until the time of acceptance. The estimated future revenue from shipments to customers in Japan was approximately $401 million as of September 25, 2022 and $367 million as of June 26, 2022. 55 + 56 + 57 +[[image:LRCX3.jpg]] 58 + 59 + 60 += Company Overview = 61 + 62 +Incorporated in 1980, Lam Research Corporation is a Delaware corporation, headquartered in Fremont, California. The company maintain a network of facilities throughout Asia, Europe, and the United States to meet the needs of dynamic customer base. 63 + 64 + 65 +Lam Research Corp. Lam Research Corporation is a global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Lam’s equipment and services allow customizing to build smaller and better performing devices.{{footnote}}https://investor.lamresearch.com{{/footnote}} 66 + 67 + 68 +== Products == 69 + 70 +The company work closely with customers to deliver the products and technologies needed to enable their success. By offering critical chip-processing capabilities, its products provide a vital link between the visionary designs for the latest electronic devices and the companies that produce them. 71 + 72 + 73 +[[image:LRCX4.png]] 74 + 75 + 76 +== Company History == 77 + 78 +In Year 1980 Company founded by David K. Lam in Santa Clara, California{{footnote}}https://www.lamresearch.com/company/history/{{/footnote}} 79 + 80 + 81 +(% style="width:690px" %) 82 +(% class="info" %)|(% style="width:94px" %)Year|(% style="width:592px" %)Company Milestones 83 +|(% style="width:94px" %)1980|(% style="width:592px" %)Company founded by David K. Lam in Santa Clara, California 84 +|(% style="width:94px" %)1981|(% style="width:592px" %)Introduced first product, the AutoEtch 85 +|(% style="width:94px" %)1984|(% style="width:592px" %)Lam became public as LRCX 86 +|(% style="width:94px" %)1985|(% style="width:592px" %)Opened first offices in Europe 87 +|(% style="width:94px" %)1987|(% style="width:592px" %)Relocated headquarters to Fremont, California 88 +|(% style="width:94px" %)1987|(% style="width:592px" %)Introduced Rainbow® etch system 89 +|(% style="width:94px" %)1988|(% style="width:592px" %)Invented single-wafer spin clean technology 90 +|(% style="width:94px" %)1989|(% style="width:592px" %)Opened first office in S. Korea 91 +|(% style="width:94px" %)1990|(% style="width:592px" %)Introduced SP Series spin clean systems 92 +|(% style="width:94px" %)1992|(% style="width:592px" %)Opened offices in Taiwan and Singapore 93 +|(% style="width:94px" %)1992|(% style="width:592px" %)Introduced first Transformer Coupled Plasma™ conductor etch products 94 +|(% style="width:94px" %)1993|(% style="width:592px" %)Opened process development center in Japan 95 +|(% style="width:94px" %)1994|(% style="width:592px" %)Established presence in China 96 +|(% style="width:94px" %)1995|(% style="width:592px" %)Introduced first Dual Frequency Confined™ dielectric etch product 97 +|(% style="width:94px" %)2000|(% style="width:592px" %)Opened office in India 98 +|(% style="width:94px" %)2000|(% style="width:592px" %)Established Lam Research Foundation 99 +|(% style="width:94px" %)2002|(% style="width:592px" %)Opened Tualatin, Oregon, campus 100 +|(% style="width:94px" %)2003|(% style="width:592px" %)Launched Da Vinci® spin clean product 101 +|(% style="width:94px" %)2004|(% style="width:592px" %)Introduced ALTUS® tungsten barrier CVD system 102 +|(% style="width:94px" %)2005|(% style="width:592px" %)Launched SOLA® UVTP film treatment system 103 +|(% style="width:94px" %)2006|(% style="width:592px" %)Acquired Bullen Semiconductor, now Silfex, Inc. 104 +|(% style="width:94px" %)2007|(% style="width:592px" %)Launched Coronus® plasma bevel clean system 105 +|(% style="width:94px" %)2008|(% style="width:592px" %)Acquired SEZ AG, now Lam Research AG 106 +|(% style="width:94px" %)2011|(% style="width:592px" %)Established Corus, now Lam Manufacturing Korea 107 +|(% style="width:94px" %)2012|(% style="width:592px" %)Acquired Novellus Systems 108 +|(% style="width:94px" %)2014|(% style="width:592px" %)Announced first manufacturing-worthy atomic layer etch: Kiyo® F Series system 109 +|(% style="width:94px" %)2016|(% style="width:592px" %)Opened the Lam Research Dr. Richard A. Gottscho Laboratory in Fremont 110 +|(% style="width:94px" %)2016|(% style="width:592px" %)Launched Lam Research Capital 111 +|(% style="width:94px" %)2017|(% style="width:592px" %)Acquired Coventor, Inc. 112 +|(% style="width:94px" %)2021|(% style="width:592px" %)Opened manufacturing facility in Malaysia 113 +|(% style="width:94px" %)2022|(% style="width:592px" %)Opened Korea Technology Center 114 + 115 += References = 116 + 117 +{{putFootnotes/}}
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