Summary

• Page properties (1 modified, 0 added, 0 removed)

Details

Page properties

Content

...	...	@@ -2,31 +2,118 @@
2	2	{{toc/}}
3	3	{{/box}}
4	4
5		-= Paragraph 1 =
	5	+= Summary =
6	6
7		-Lorem ipsum dolor sit amet, consectetur adipiscing elit, sed do eiusmod tempor incididunt ut labore et dolore magna aliqua. Ut enim ad minim veniam, quis nostrud exercitation ullamco laboris nisi ut aliquip ex ea commodo consequat. Duis aute irure dolor in reprehenderit in voluptate velit esse cillum dolore eu fugiat nulla pariatur. Excepteur sint occaecat cupidatat non proident, sunt in culpa qui officia deserunt mollit anim id est laborum.
	7	+* Lam Research Corp is a global supplier of wafer fabrication equipment and services to the semiconductor industry.
	8	+* Lam Research Corp maintain a network of facilities throughout Asia, Europe, and the United States.
	9	+* Recently Lam Research Acquired SEMSYSCO.
8	8
9		-== Sub-paragraph ==
10	10
11		-Lorem ipsum dolor sit amet, consectetur adipiscing elit, sed do eiusmod tempor incididunt ut labore et dolore magna aliqua. Ut enim ad minim veniam, quis nostrud exercitation ullamco laboris nisi ut aliquip ex ea commodo consequat. Duis aute irure dolor in reprehenderit in voluptate velit esse cillum dolore eu fugiat nulla pariatur. Excepteur sint occaecat cupidatat non proident, sunt in culpa qui officia deserunt mollit anim id est laborum.
12	12
13		-== Sub-paragraph ==
	13	+[[image:LRCX0.png||height="243" width="719"]]
14	14
15		-Lorem ipsum dolor sit amet, consectetur adipiscing elit, sed do eiusmod tempor incididunt ut labore et dolore magna aliqua. Ut enim ad minim veniam, quis nostrud exercitation ullamco laboris nisi ut aliquip ex ea commodo consequat. Duis aute irure dolor in reprehenderit in voluptate velit esse cillum dolore eu fugiat nulla pariatur. Excepteur sint occaecat cupidatat non proident, sunt in culpa qui officia deserunt mollit anim id est laborum.
16	16
17		-=== Sub-sub paragraph ===
	16	+Lam Research Corp (Nasdaq: LRCX, LSE: 0JT5) is a global supplier of wafer fabrication equipment and services to the semiconductor industry. The company maintain a network of facilities throughout Asia, Europe, and the United States.
18	18
19		-Lorem ipsum dolor sit amet, consectetur adipiscing elit, sed do eiusmod tempor incididunt ut labore et dolore magna aliqua. Ut enim ad minim veniam, quis nostrud exercitation ullamco laboris nisi ut aliquip ex ea commodo consequat. Duis aute irure dolor in reprehenderit in voluptate velit esse cillum dolore eu fugiat nulla pariatur. Excepteur sint occaecat cupidatat non proident, sunt in culpa qui officia deserunt mollit anim id est laborum.
20	20
	19	+= Recent Developments =
21	21
22		-= Paragraph 2 =
	21	+**Lam Research Acquires SEMSYSCO to Advance Chip Packaging**{{footnote}}https://newsroom.lamresearch.com/2022-11-15-Lam-Research-Acquires-SEMSYSCO-to-Advance-Chip-Packaging{{/footnote}}
23	23
24		-Lorem ipsum dolor sit amet, consectetur adipiscing elit, sed do eiusmod tempor incididunt ut labore et dolore magna aliqua. Ut enim ad minim veniam, quis nostrud exercitation ullamco laboris nisi ut aliquip ex ea commodo consequat. Duis aute irure dolor in reprehenderit in voluptate velit esse cillum dolore eu fugiat nulla pariatur. Excepteur sint occaecat cupidatat non proident, sunt in culpa qui officia deserunt mollit anim id est laborum.
	23	+Nov. 15, 2022; Lam Research Corp. announced that it has completed the acquisition of SEMSYSCO GmbH, a global provider of wet processing semiconductor equipment from Gruenwald Equity and other investors. With the addition of SEMSYSCO, Lam gains capabilities in advanced packaging, ideal for leading-edge logic chips and chiplet-based solutions for high-performance computing (HPC), artificial intelligence (AI) and other data-intensive applications. Financial terms of the agreement were not disclosed.
25	25
26		-== Sub-paragraph ==
27	27
28		-Lorem ipsum dolor sit amet, consectetur adipiscing elit, sed do eiusmod tempor incididunt ut labore et dolore magna aliqua. Ut enim ad minim veniam, quis nostrud exercitation ullamco laboris nisi ut aliquip ex ea commodo consequat. Duis aute irure dolor in reprehenderit in voluptate velit esse cillum dolore eu fugiat nulla pariatur. Excepteur sint occaecat cupidatat non proident, sunt in culpa qui officia deserunt mollit anim id est laborum.
	26	+The acquisition of SEMSYSCO broadens Lam's packaging offerings, bringing a portfolio of innovative cleaning and plating capabilities for chiplet-to-chiplet or chiplet-to-substrate heterogeneous integration. This includes support of fan-out panel-level packaging, a game-changing process in which chips or chiplets are cut from a large, rectangular substrate sheet several times the size of a traditional silicon wafer. This approach enables chipmakers to significantly increase yield and reduce waste.
29	29
30		-== Sub-paragraph ==
31	31
32		-Lorem ipsum dolor sit amet, consectetur adipiscing elit, sed do eiusmod tempor incididunt ut labore et dolore magna aliqua. Ut enim ad minim veniam, quis nostrud exercitation ullamco laboris nisi ut aliquip ex ea commodo consequat. Duis aute irure dolor in reprehenderit in voluptate velit esse cillum dolore eu fugiat nulla pariatur. Excepteur sint occaecat cupidatat non proident, sunt in culpa qui officia deserunt mollit anim id est laborum.
	29	+With the acquisition of SEMSYSCO, Lam also gains a state-of-the-art R&D facility in Austria focused on next-generation substrates and heterogeneous packaging, broadening the company's strong development capabilities in Europe and adding a sixth lab in Lam's global network. In addition, it brings to Lam new and expanded relationships with chipmakers and fabless customers.
	30	+
	31	+
	32	+[[image:LRCX1.jpg]]
	33	+
	34	+
	35	+= Financial Highlights =
	36	+
	37	+**September 2022 Quarter Results**
	38	+
	39	+Oct. 19, 2022; Lam Research Corporation announced financial results for the quarter ended September 25, 2022{{footnote}}https://newsroom.lamresearch.com/Lam-Research-Corporation-Reports-Financial-Results-for-the-Quarter-Ended-September-25,-2022{{/footnote}}
	40	+
	41	+
	42	+For the September 2022 quarter, revenue was $5,074 million, gross margin was $2,337 million, or 46.1% of revenue, operating expenses were $639 million, operating income was 33.5% of revenue, and net income was $1,426 million, or $10.39 per diluted share on a U.S. GAAP basis. This compares to revenue of $4,636 million, gross margin of $2,101 million, or 45.3% of revenue, operating expenses of $621 million, operating income of 31.9% of revenue, and net income of $1,209 million, or $8.74 per diluted share, for the quarter ended June 26, 2022.
	43	+
	44	+
	45	+Non-GAAP Financial Results
	46	+
	47	+For the September 2022 quarter, non-GAAP gross margin was $2,335 million, or 46.0% of revenue, non-GAAP operating expenses were $647 million, non-GAAP operating income was 33.3% of revenue, and non-GAAP net income was $1,429 million, or $10.42 per diluted share. This compares to non-GAAP gross margin of $2,094 million, or 45.2% of revenue, non-GAAP operating expenses of $635 million, non-GAAP operating income of 31.5% of revenue, and non-GAAP net income of $1,221 million, or $8.83 per diluted share, for the June 2022 quarter.
	48	+
	49	+
	50	+Balance Sheet and Cash Flow Results
	51	+
	52	+Cash and cash equivalents, short-term investments, and restricted cash and investments balances increased to $4.6 billion at the end of the September 2022 quarter compared to $3.9 billion at the end of the June 2022 quarter. This increase was primarily the result of $1,190 million of cash generated from operating activities, partially offset by $206 million of dividends paid to stockholders; $140 million of capital expenditures; and $110 million of share repurchases, including net share settlement of employee stock-based compensation.
	53	+
	54	+
	55	+Deferred revenue at the end of the September 2022 quarter increased to $2,755 million compared to $2,198 million as of the end of the June 2022 quarter. Lam's deferred revenue balance does not include shipments to customers in Japan, to whom title does not transfer until customer acceptances. Shipments to customers in Japan are classified as inventory at cost until the time of acceptance. The estimated future revenue from shipments to customers in Japan was approximately $401 million as of September 25, 2022 and $367 million as of June 26, 2022.
	56	+
	57	+
	58	+[[image:LRCX3.jpg]]
	59	+
	60	+
	61	+= Company Overview =
	62	+
	63	+Incorporated in 1980, Lam Research Corporation is a Delaware corporation, headquartered in Fremont, California. The company maintain a network of facilities throughout Asia, Europe, and the United States to meet the needs of dynamic customer base.
	64	+
	65	+
	66	+Lam Research Corp. Lam Research Corporation is a global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Lam’s equipment and services allow customizing to build smaller and better performing devices.{{footnote}}https://investor.lamresearch.com{{/footnote}}
	67	+
	68	+
	69	+== Products ==
	70	+
	71	+The company work closely with customers to deliver the products and technologies needed to enable their success. By offering critical chip-processing capabilities, its products provide a vital link between the visionary designs for the latest electronic devices and the companies that produce them.
	72	+
	73	+
	74	+[[image:LRCX4.png]]
	75	+
	76	+
	77	+== Company History ==
	78	+
	79	+In Year 1980 Company founded by David K. Lam in Santa Clara, California{{footnote}}https://www.lamresearch.com/company/history/{{/footnote}}
	80	+
	81	+
	82	+(% style="width:690px" %)
	83	+(% class="info" %)|(% style="width:94px" %)Year|(% style="width:592px" %)Company Milestones
	84	+|(% style="width:94px" %)1980|(% style="width:592px" %)Company founded by David K. Lam in Santa Clara, California
	85	+|(% style="width:94px" %)1981|(% style="width:592px" %)Introduced first product, the AutoEtch
	86	+|(% style="width:94px" %)1984|(% style="width:592px" %)Lam became public as LRCX
	87	+|(% style="width:94px" %)1985|(% style="width:592px" %)Opened first offices in Europe
	88	+|(% style="width:94px" %)1987|(% style="width:592px" %)Relocated headquarters to Fremont, California
	89	+|(% style="width:94px" %)1987|(% style="width:592px" %)Introduced Rainbow® etch system
	90	+|(% style="width:94px" %)1988|(% style="width:592px" %)Invented single-wafer spin clean technology
	91	+|(% style="width:94px" %)1989|(% style="width:592px" %)Opened first office in S. Korea
	92	+|(% style="width:94px" %)1990|(% style="width:592px" %)Introduced SP Series spin clean systems
	93	+|(% style="width:94px" %)1992|(% style="width:592px" %)Opened offices in Taiwan and Singapore
	94	+|(% style="width:94px" %)1992|(% style="width:592px" %)Introduced first Transformer Coupled Plasma™ conductor etch products
	95	+|(% style="width:94px" %)1993|(% style="width:592px" %)Opened process development center in Japan
	96	+|(% style="width:94px" %)1994|(% style="width:592px" %)Established presence in China
	97	+|(% style="width:94px" %)1995|(% style="width:592px" %)Introduced first Dual Frequency Confined™ dielectric etch product
	98	+|(% style="width:94px" %)2000|(% style="width:592px" %)Opened office in India
	99	+|(% style="width:94px" %)2000|(% style="width:592px" %)Established Lam Research Foundation
	100	+|(% style="width:94px" %)2002|(% style="width:592px" %)Opened Tualatin, Oregon, campus
	101	+|(% style="width:94px" %)2003|(% style="width:592px" %)Launched Da Vinci® spin clean product
	102	+|(% style="width:94px" %)2004|(% style="width:592px" %)Introduced ALTUS® tungsten barrier CVD system
	103	+|(% style="width:94px" %)2005|(% style="width:592px" %)Launched SOLA® UVTP film treatment system
	104	+|(% style="width:94px" %)2006|(% style="width:592px" %)Acquired Bullen Semiconductor, now Silfex, Inc.
	105	+|(% style="width:94px" %)2007|(% style="width:592px" %)Launched Coronus® plasma bevel clean system
	106	+|(% style="width:94px" %)2008|(% style="width:592px" %)Acquired SEZ AG, now Lam Research AG
	107	+|(% style="width:94px" %)2011|(% style="width:592px" %)Established Corus, now Lam Manufacturing Korea
	108	+|(% style="width:94px" %)2012|(% style="width:592px" %)Acquired Novellus Systems
	109	+|(% style="width:94px" %)2014|(% style="width:592px" %)Announced first manufacturing-worthy atomic layer etch: Kiyo® F Series system
	110	+|(% style="width:94px" %)2016|(% style="width:592px" %)Opened the Lam Research Dr. Richard A. Gottscho Laboratory in Fremont
	111	+|(% style="width:94px" %)2016|(% style="width:592px" %)Launched Lam Research Capital
	112	+|(% style="width:94px" %)2017|(% style="width:592px" %)Acquired Coventor, Inc.
	113	+|(% style="width:94px" %)2021|(% style="width:592px" %)Opened manufacturing facility in Malaysia
	114	+|(% style="width:94px" %)2022|(% style="width:592px" %)Opened Korea Technology Center
	115	+
	116	+
	117	+References
	118	+
	119	+{{putFootnotes/}}